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Development of Copper Clad Laminate with Low Dielectric Loss Materials for High Frequency Devices

机译：具有低介电损耗材料的高频率损耗材料的铜包层压板的研制

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Jun Nunoshige;
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1. Fabrication and origin of flame retarding glass fiber/bismaleimide resin composites with high thermal stability, good mechanical properties, and a low dielectric constant and loss for high frequency copper clad laminates [J] . Zhang Zhiyong, Yuan Li, Liang Guozheng, RSC Advances . 2016,第24期

机译：具有高热稳定性，良好机械性能的阻燃玻璃纤维/双聚酰胺树脂复合材料的制造和起源，以及高频铜包层压板的低介电常数和损耗
2. Fabrication and origin of flame retarding glass fiber/bismaleimide resin composites with high thermal stability, good mechanical properties, and a low dielectric constant and loss for high frequency copper clad laminates [J] . Zhiyong Zhang, Li Yuan, Guozheng Liang, RSC Advances . 2016,第24期

机译：具有高热稳定性，良好机械性能的阻燃玻璃纤维/双聚酰胺树脂复合材料的制造和起源，以及高频铜包层压板的低介电常数和损耗
3. Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination [J] . Wang Chong, Wen Na, Zhou Guoyun, Applied Surface Science . 2017,第nova15期

机译：在覆铜层压板上添加锡可增加界面粘合力，从而减少高频PCB层压的信号损耗
4. Terahertz- Wave Generation Devices Using Electro-Optic Polymer Waveguides and Terahertz-Wave Low-Loss Cladding Materials [C] . Takahiro Kaji, Yukihiro Tominari, Toshiki Yamada, International Conference on Infrared, Millimeter, and Terahertz Waves . 2018

机译：使用光电聚合物波导和太赫兹波低损耗熔覆材料的太赫兹波产生装置
5. Advanced copper/low-k IC devices: Packaging process development and materials integrtion. [D] . Chungpaiboonpatana, Surasit. 2005

机译：先进的铜/低k IC器件：封装工艺开发和材料集成。
6. Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates [O] . Yao-yao Tan, Yan Zhang, Gang-lan Jiang, 2020

机译：热膨胀系数极低的固有黑色聚酰亚胺薄膜的制备和性能及其在黑色柔性覆铜箔层压板中的潜在应用
7. MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications [O] . Jianming Guo, Hao Wang, Caixia Zhang, 2020

机译：具有低介电损耗的MPPE / SEBS复合材料，适用于高频铜包层压板应用
8. Development of structural materials exhibiting dielectric and magnetic loss at radio frequencies [R] . Duke, J. R., Apen, P. G., Hoisington, M. 1996

机译：开发在射频上表现出介电和磁损耗的结构材料

Development of Copper Clad Laminate with Low Dielectric Loss Materials for High Frequency Devices

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