The effects of misalignment on a flip chip structure are studied with the finite element method (FEM) using three-dimensional (3-D) models. The accumulated plastic work on third temperature cycle in a corner bump is used to compare the reliabilities of structures with different misalignments. The results show that generally misalignment decreases the reliability of a flip chip package. However, unequal spacing of pads on chip and substrate can improve the reliability.
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