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OPTIMIZATION OF ULTRA-THIN BODY,FULLY-DEPLETED-SOI DEVICE,WITH RAISED SOURCE/DRAIN

机译:优化超薄车身,全耗尽-SOI装置,带凸起源/排水管

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We report on an ultra-thin body,fully depleted SOI device (FDSOI),with metal gate,raised source/drain,and its optimization via simulation.The physical gate length is 60 nm,the film thickness under the gate is 10 nm,and is undoped.The gate electrode is mid-gap,i.e.,a workfunction of 4.6 eV.The source and drain regions are constant doping.The overlap region doping is Gaussian with a junction depth defined as the point at which the doping concentration drops to 10~(16) cm~(-3),which for this device is 3 nm.Hydrodynamic simulations for capturing velocity overshoot are employed,with an energy relaxation time of 0.3 ps,and predicted I_(Dsat) is checked with Monte Carlo (1,2).Silicide resistivity is also included via a distributed resistance on S/D contacts (3),in both the continuum solver as well as Monte Carlo.The mobility model is from (4).
机译:我们报告超薄体,完全耗尽的SOI器件(FDSOI),具有金属栅极,凸起的源/漏极,并通过模拟优化。物理栅极长度为60nm,栅极下的膜厚度为10nm,并且未常见。栅电极是中间间隙,即4.6 eV的工作障碍。源和漏区是恒定的掺杂。重叠区域掺杂是高斯的高斯深度定义为掺杂浓度下降的点对于该装置的10〜(16)cm〜(-3)是3nm.采用捕获速度过冲的流体动力学模拟,能量松弛时间为0.3 ps,并用蒙特卡罗检查预测的i_(dsat)(dsat)( 1,2)。硅片电阻率也通过在连续求解器以及蒙特卡罗的S / D触点(3)上的分布电阻包括。移动性模型来自(4)。

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