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Texture of Sputtered Thin Copper Films on Amorphous SiO_2 and Si_3N_4 substrates

机译:溅射的薄铜薄膜纹理在无定形SiO_2和Si_3n_4基板上

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Cu films with thickness of 500nm and 5 nm have been sputter deposited on amorphous SiO_2 and Si_3N-4 substrates without and after sputter cleaning.The crystallographic texture has been characterized by x-ray diffraction techniques.Sputter cleaning of the substrates,by which the oxygen contaminants are removed from the Si_3N_4 substrates,leads to an increase in the {111} texture strength and sharpness of the Cu films on Si_3N_4.The texture ios sharper in the 500nm thick Cu films than in the 5nm thick films.Roughness differences of the substrate surfaces have no obvious effect on the texture state.
机译:厚度为500nm和5nm的Cu膜在无定形SiO_2和Si_3N-4基板上溅射,溅射清洁。结晶纹理的特征在于X射线衍射技术。基板的仿效,氧气从Si_3N_4底物中除去污染物,导致Si_3N_4上的Cu膜的{111}纹理强度和锐度增加。在500nm厚的Cu膜中的纹理IOS尖锐,而不是在5nm厚的薄膜中。基板的差异差异表面对纹理状态没有明显的影响。

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