Copper thin film substrate with a undercoating agent, a method of manufacturing a thin copper film with the substrate and the copper thin film substrate with and electrically conductive film,

摘要

PROBLEM TO BE SOLVED: To provide an undercoating agent which is excellent not only in initial adhesiveness between a substrate and a copper thin film but also in adhesiveness between a substrate and a copper thin film after the copper thin film substrate is treated with an alkali solution and an acidic solution.SOLUTION: There is provided an undercoating agent for a substrate with a copper thin film which comprises: an acrylic copolymer (A) having a hydroxyl group, an alkyl ester group, a nitrile group and a primary amide group; a polyisocyanate (B) having at least three isocyanate groups; an active energy ray-polymerizable compound (C) having at least three carbon-carbon double bond-containing groups; and a reactive alkoxysilyl compound (D) represented by the general formula (1) X-Si(R)(OR)(Xrepresents a group containing a functional group reacting with at least one group selected from a hydroxyl group, an isocyanate group or a polymerizable carbon-carbon double bond-containing group, Rrepresents H or a hydrocarbon group having 1 to 8 carbon atoms, Rrepresents a hydrocarbon group having 1 to 8 carbon atoms, and a represents an integer of 0 to 2.)SELECTED DRAWING: None