首页> 外文会议>IEEE International Interconnect Technology Conference >A Modified Herman Model for the Prediction of Time-Dependent Dielectric Breakdown (TDDB) Characteristics of Low-k/ULK Interconnect Dielectrics from Dual-Voltage Ramp Dielectric Breakdown (DVRDB) Test
【24h】

A Modified Herman Model for the Prediction of Time-Dependent Dielectric Breakdown (TDDB) Characteristics of Low-k/ULK Interconnect Dielectrics from Dual-Voltage Ramp Dielectric Breakdown (DVRDB) Test

机译:一种改进的Herman模型,用于预测低k / ULK互连电介质的时间依赖性介电击穿(TDDB)特性从双电压斜坡介电击穿(DVRDB)测试

获取原文

摘要

We present a modified Berman model that relates breakdown voltage distributions, from dual voltage ramp dielectric breakdown (DVRDB) test, to the distribution of time-to-fail (TTF) during constant voltage stress (CVS) conditions, assuming that dielectric failure behavior under a constant voltage stress follows the square-root E-model. The methodology presented in this work demonstrates a fast and very effective way of extracting the voltage acceleration parameter (i.e., electric field dependence) and predicting TTF under CVS TDDB test conditions. Both low-k (k=2.7) and ULK(k<2.5) DVRDB and CVS TDDB data of 45nm and 32nm dielectrics are presented, along with the model predictions and Monte-Carlo simulation results.
机译:我们介绍了一种改进的BERMAN模型,该模型与双电压斜坡介电击穿(DVRDB)测试相关的击穿电压分布,以恒压应力(CVS)条件期间的时间到失败(TTF)的分布,假设介电故障行为下恒定的电压应力遵循平方根电子模型。本作品中呈现的方法显示了一种快速而非常有效的方式,可以在CVS TDDB测试条件下提取电压加速度参数(即,电场依赖性)并预测TTF。 Low-K(k = 2.7)和ULK(k <2.5)DVRDB和CVS TDDB数据均呈现45nm和32nm电介质的数据,以及模型预测和Monte-Carlo仿真结果。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号