Effect of deformation strain on interface development and bond strangth of roll bonded copper/aluminium laminate composites

摘要

Metal laminate composites of copper/aluminium were prepared by roll bondingwith various rolling strains. Effect of therolling strain on the interface development andbond strength of the composites was examined. Itwas found that as the rolling strain increased thebond strength of the composites was generallyenhanced in both as-rolled and sintered condition.Critical sintering conditions were found to existfor achieving optimum bond strength of thecomposites. It is evident that development of theoptimum strengths of the composites is related tothe formation of various intermetallic phases atthe interface which is in turn determined by thediffusion activity of the metallic elements in thearea. A strong strength enhancement was generallyobserved to develop in the 60% rolled samples,suggesting that deformation strain of the rollbonding process may impose great influence ondiffusion of the metallic elements. When thealuminium-rich phases of faceted interfacedeveloped, the bond strength of the composites was substantially increased.