Copper clad laminate for processing the copper foil and the copper-clad laminate and printed wiring board using the copper-clad laminate obtained by bonding the treated copper foil to the insulating resin substrate

摘要

PROBLEM TO BE SOLVED: To provide a treated copper foil which exhibits firm peel strength to an insulating resin substrate regardless of low roughness degree, and in which after the treated copper foil is subjected to hygroscopic treatment and then immersed in an activating treatment liquid, the deterioration rate of peel strength is made to be low, and the amount of the activating treatment liquid to soak thereinto is small after the treated copper foil is immersed in the activating treatment liquid, and which has excellent etching properties.;SOLUTION: A roughened layer, a chromate layer and a silane coupling agent layer are arranged successively on the surface of the treated copper foil to be stuck to the insulating resin substrate. The surface of the treated copper foil has ten-point average roughness Rz of 1.0-2.7 m, and the local crests has average space S of 0.0230 mm (except 0).;COPYRIGHT: (C)2012,JPO&INPIT