Current prevalent heat sink attachment techniques involve either an adhesive approach or a separable (stud+nut) approach. The adhesive approach is inexpensive but transmit thermally induced stresses to the package. and the heat sink can not be assembled/disassembled from the package at any time. The maufacturing and assembly of a heat sink for a seqarable approach is relatively expensive. Therefore, a new "clip-on" heat sink attachment approach was developed to reduce heat sink attachment costs and to simplify the assembly processes.
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