Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

摘要

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to extreme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions.