Mechanistic and Electrochemical Aspects of Copper Post CMP Cleaners for 5-7 nm Nodes(PPT)

摘要

1. Charge repulsion shown to be a key driver towards cleaning performance 2. Rate of attack on Cuf li-BTA polymer, dispersion and complexation important for removal and preventing re-deposition of organic residues and particles 3. OCP gap must be minimized by optimal iigand selection to minimize galvanic corrosion Impedance spectroscopy and Tafei plots have been used to Optimize corrosion inhibiting package 4. Very low Cu roughnesses can be obtained with the correct inhibitor (4 A)