The European 3D Heterogeneous Integration Platform (e-BRAINS) - a Particular Focus on Reliability and Low-Temperature Processes for 3D Integrated Sensor Systems

摘要

The European 3D heterogeneous integration platform has been established by the consortium of the Integrated Project e-BRAINS [1], where technologies of the following relevant main categories of 3D integration are provided to enable future applications of smart sensor systems: 3D System-on-Chip Integration - 3D-SOC: TSV technology for stacking of thinned devices or large IC blocks (global level), 3D Wafer-Level-Packaging - 3D-WLP: embedding technology with through-polymer vias (TPV) for stacking of thinned ICs on wafer-level (no TSV), and 3D System-in-Package - 3D-SIP: 3D stacking of packaged devices or substrates.