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IGBT field-stop design for good short circuit ruggedness and a better trade-off with respect to static and dynamic switching characteristics

机译:IGBT现场停止设计对于良好的短路坚固性和静态和动态开关特性的更好的折衷

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The doping profile of the field-stop zone influences the static characteristics (V, V) and the dynamic switching characteristics (di/dt, dV/dt, softness) of IGBTs. Furthermore, the short-circuit ruggedness is strongly influenced by the rear side structure of the IGET. In this work, box-like field-stop profiles in combination with a constant p-emitter were analyzed by TCAD simulations. The findings were used to optimize and realize field-stop profiles by proton implantation with the focus to achieve an improved short-circuit ruggedness at the same softness.
机译:场停止区的掺杂曲线影响IGBT的静态特性(V,V)和动态开关特性(DI / DT,DV / DT,柔软度)。此外,短路坚固性受到IGET的后侧结构的强烈影响。在这项工作中,通过TCAD模拟分析了与恒定P发射器结合恒定P发射器的框状场停止配置文件。通过质子植入利用焦点来实现该发现来优化和实现现场停止型材,以实现在相同柔软性处的改进的短路粗糙度。

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