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IGBT field-stop design for good short circuit ruggedness and a better trade-off with respect to static and dynamic switching characteristics

机译:IGBT场停止设计具有良好的短路耐用性,并在静态和动态开关特性方面取得了较好的折衷

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摘要

The doping profile of the field-stop zone influences the static characteristics (V, V) and the dynamic switching characteristics (di/dt, dV/dt, softness) of IGBTs. Furthermore, the short-circuit ruggedness is strongly influenced by the rear side structure of the IGET. In this work, box-like field-stop profiles in combination with a constant p-emitter were analyzed by TCAD simulations. The findings were used to optimize and realize field-stop profiles by proton implantation with the focus to achieve an improved short-circuit ruggedness at the same softness.
机译:场停止区的掺杂分布会影响IGBT的静态特性(V,V)和动态开关特性(di / dt,dV / dt,软度)。此外,短路耐用性受IGET的后侧结构强烈影响。在这项工作中,通过TCAD仿真分析了与恒定p发射极结合的类似盒形的场停止曲线。这些发现被用于通过质子注入优化和实现场截止分布,重点是在相同的柔软度下实现改善的短路坚固性。

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