Development and characterization of bio-based PA composites for electronic packaging applications using micro fillers

摘要

Since electronic devices are constantly becoming smaller and more powerful [1,3], heat dissipation plays a very important role in electronic packaging applications. By using highly thermal conductive materials, it is possible to manage the heat dissipation on electronics to improve their efficiency. In addition, it is possible to avoid the use of mechanical fans by avoiding the heat sink cooling method. Thus, electronics can be made cheaper, lighter, and more compact [4-8]. Recycling of electronics is also another concern because millions of devices are used and produced every day. This research is aimed at making a polymeric composite that has high thermal conductivity, is electrically isolative, and is bio-based: a suitable as a replacement candidate for current electronic packaging materials. In this study, Polyamide (PA) with at least 60% bio-based content in composite with hexagonal boron nitride (hBN) was studied. Significant improvement in thermal conductivity was found relating to the size of conductive network, which has direct relationship with numbers, length, and direction of thermal pathways, rather than amount of filler particles.