Dielectric properties and thermal properties of calcium copper titanate and barium titanate hybrid fillers filled epoxy thin film composites for electronic packaging applications

摘要

Ceramic fillers such as calcium copper titanate, CaCu_3Ti_4O_(12) (CCTO) and barium titanate (BaTiO_3) were used as hybrid fillers to produce hybrid thin film composites for electronic packaging applications. Results indicated that positive hybrid effect in dielectric and thermal properties showed by the hybrid composites. Hybrid fillers with the ratio of 70:30 of CCTO:BaTiO_3 filled epoxy thin film composite exhibited the highest dielectric constant, lowest coefficient thermal expansion value, moderate thermal stability and dynamic mechanical properties compared to those of hybrid composites with the ratio of 30:70 and 50:50, unfilled epoxy, 20 CEC and 20 BEC, respectively.