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Preparation of single-domain. Si(100) surfaces with in situ control in CVD ambient

机译:单域的制备。 SI(100)在CVD环境中具有原位控制的表面

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III-V films grown heteroepitaxially on Si(100) substrates by metal-organic chemical vapor deposition (MOCVD) are desired for the combination of optoelectronics with microelectronic devices. Difficulties regarding device quality are related to the formation of the crucial III-V/Si(100) interface, where single-layer steps on the substrate surface induce anti? phase disorder in the epitaxial film. In principle, double-layer steps on the Si(100) substrate prevent the occurrence of anti? phase disorder. While the preparation of silicon surfaces is well-established in UHV, preparation in H_2 ambient differs considerably. Considered energetically least favorable on both the clean and the monohydride-terminated Si(100) surface, single domain surfaces with double layer steps in the unusual DA configuration were recently prepared in MOCVD ambient. The D_A step formation on Si(100) with 2° offcut in CVD ambient is suggested to originate in vacancy generation and diffusion on the terraces accompanied by preferential annihilation at the step edges. Here, we investigate Si removal and vacancy formation on Si(100) substrates with large terraces under CVD preparation conditions. With in situ reflection anisotropy spectroscopy (RAS), we directly observe the domain formation in dependence of the preparation route. Oscillations in transient RA measurements indicate layer by layer Si removal during annealing in hydrogen. Based on scanning tunneling microscopy results, we conclude that vacancy island formation and anisotropic expansion preferentially in parallel to the dimer rows of the terraces explains the layer-by-layer Si removal process.
机译:期望通过金属 - 有机化学气相沉积(MOCVD)在Si(100)底物上生长杂膜的III-V膜,用于光电子与微电子器件的组合。有关设备质量的困难与关键III-V / SI(100)界面的形成有关,其中基板表面上的单层步骤诱导抗α外延膜中的相紊乱。原则上,Si(100)衬底上的双层步骤防止发生抗?相紊乱。虽然硅表面的制备在UHV中良好建立,但H_2环境中的制备显着不同。最近在MOCVD Acmient中最近制备了在Mocvd Acmient中最近制备不存在的DA配置中具有双层步骤的单层域的单层阶段的单层步骤的能量最低。在CVD环境中具有2°邻接的Si(100)上的D_A步骤形成,以源自在步骤边缘的优先湮灭的梯田上的空位产生和扩散。在此,我们在CVD制备条件下调查Si(100)衬底上的Si(100)衬底上的空隙和空位形成。使用原位反射各向异性光谱(RAS),我们直接观察准备途径的畴形成。瞬态RA测量中的振荡表示通过在氢气退火期间通过层SI去除层。基于扫描隧穿显微镜的结果,我们得出结论,与梯田的二聚体行平行的空位岛形成和各向异性膨胀解释了逐层Si去除过程。

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