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Analysis of Intrinsic and Parasitic Gate Delay of InGaAs HEMTs

机译:InGaAs Hemts的内在和寄生栅延迟分析

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In this paper, the principles, measurement techniques, and analysis of the gate delay of high-electron-mobility-transistors (HEMTs) mainly based on an InP material system are discussed. In the measurement techniques, de-embedding of the pad parasitics is also described. The intrinsic part of the gate delay of HEMTs is the transit time for electrons to travel in the gate depletion region. When the gate length is large enough, the intrinsic gate delay is dominant in the total gate delay. However, as the gate length becomes less than 100 nm, the delay analysis reveals that the intrinsic gate delay is now no longer dominant but the parasitic gate delay ascribed to the resistance and capacitance out of the gate region. Based on these results, ways for further improvement of the frequency response are also discussed.
机译:在本文中,讨论了主要基于INP材料系统的高电子移动晶体管(HEMT)栅极延迟的原理,测量技术和分析。在测量技术中,还描述了垫寄生剂的去嵌入。 HEMT的栅极延迟的内在部分是电子在栅极耗尽区中行进的传输时间。当栅极长度足够大时,内在栅极延迟在总栅极延迟中占主导地位。然而,随着栅极长度大于100nm,延迟分析表明,内在栅极延迟现在不再是主导,但是寄生栅延迟归因于栅极区域的电阻和电容。基于这些结果,还讨论了进一步改善频率响应的方法。

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