Highly-efficient Polishing Technology for Glass Substrates Using Tribo-chemical Polishing with Electrically Controlled Slurry

摘要

The outstanding advantage of the novel polishing technology developed by the authors is a considerable reduction in cerium oxide consumption for polishing of glass substrates. This has been realized by introducing tribo-chemical polishing method along with a technique to control the movement of abrasives using an AC electric field. In this paper, we have analyzed the characteristics of the new polishing technique from the viewpoint of slurry distribution in the polishing area under various electric field conditions using a digital image processing and its influence on polishing performance using the experimental setup consisting of high speed polishing method under AC electric field. The results confirmed the increase of slurry distribution in the polishing area under appropriate AC electric field conditions and consequently led to enhanced removal rate, which was 2.5 times higher than that of the conventional CMP (Chemical Mechanical polishing) method. Furthermore, in spite of enhanced removal rate the surface roughness was comparable to CMP method.