首页> 外国专利> CERIUM POLISHING MATERIAL, CERIUM POLISHING MATERIAL SLURRY, METHOD FOR POLISHING GLASS SUBSTRATE AND METHOD FOR PRODUCING GLASS SUBSTRATE

CERIUM POLISHING MATERIAL, CERIUM POLISHING MATERIAL SLURRY, METHOD FOR POLISHING GLASS SUBSTRATE AND METHOD FOR PRODUCING GLASS SUBSTRATE

机译:铈抛光材料,铈抛光材料浆液,玻璃基质的抛光方法和玻璃基质的生产方法

摘要

PROBLEM TO BE SOLVED: To obtain a cerium polishing material capable of increasing the polishing rate, slightly causing flaws in a polished surface of a polished material to be polished, having a small surface roughness and good quality, sustaining the high polishing rate over a long period and carrying out polishing with high efficiency.;SOLUTION: The cerium polishing material consists essentially of cerium oxide and has a settling bulk density within the range of 0.8-1.0 g/ml when 10 mass% of the polishing material is dispersed in water. The primary particle diameter is within the range of 40-80 nm and the specific surface area is within the range of 2-5 m2/g.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:获得一种铈抛光材料,该铈抛光材料能够提高抛光速率,在待抛光的抛光材料的抛光表面上略微造成缺陷,具有小的表面粗糙度和良好的品质,可长期保持高抛光速率。解决方案:铈抛光材料主要由氧化铈组成,当将10质量%的抛光材料分散在水中时,其沉降堆积密度在0.8-1.0 g / ml的范围内。一次粒径在40-80 nm范围内,比表面积在2-5 m 2 / g范围内;版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP2003213250A

    专利类型

  • 公开/公告日2003-07-30

    原文格式PDF

  • 申请/专利权人 SHOWA DENKO KK;

    申请/专利号JP20020331794

  • 发明设计人 BESSHO NAOKI;

    申请日2002-11-15

  • 分类号C09K3/14;B24B37/00;

  • 国家 JP

  • 入库时间 2022-08-22 00:16:42

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