Epitaxial film bonding technology for integrating dissimilar device materials

摘要

We have developed "epitaxial-film-bonding (EFB)" technology for integrating light emitting diodes (LEDs) and integrated circuit (IC) drivers. This study is focused on testing the EFB technology to fabricate two-dimensional thin film LED arrays on substrates of various materials. Transferring the thin film LED device structure that were formed on the GaAs substrates to the other substrates was tested. All the thin film LED arrays tested in this study show good performance. The EFB technology will provide new "Digital Fabrication" process for integrating dissimilar materials.