INVESTIGATION OF THE THERMAL DEFORMATION OF ELECTRONIC PACKAGES WITH ELECTRONIC SPECKLE PATTERN INTERFEROMETRY

摘要

Electronic components are used in the automotive, communication, aerospace and other industries. Miniaturization, higher package density and accelerated development processes have a great impact on the reliability of components. Rapid changes of ambient temperature or internal production of heat may occur during operation. This may create high thermal stresses due to the mismatch of the thermal expansion coefficients of the different materials in electronic components. Nowadays, a big amount of the car recalls by the manufacturers are due to electronic malfunctions.