Fringe analysis method for electronic speckle pattern interferometry using only speckle patterns before and after deformation

摘要

Electronic speckle pattern interferometry is employed in many industrial fields as a useful deformation measurement method. However, two speckle patterns obtained before and after the deformation are necessary for measurement. Furthermore, at least three speckle patterns are required for high resolution measurement using ordinary fringe scanning technologies. In this paper, a novel method that can measure high speed deformations using a limited number of speckle patterns without using high speed cameras is proposed. The method enables application to dynamic deformation analysis because the method involves analysis using only two speckle patterns obtained before and after the deformation. A novel optical system that can record some spatial information into each speckle is set up for the method. In experimental results, it is confirmed that the out-of-plane deformation measurement can be precisely performed by the method and that the resolution power is almost equivalent to that of the ordinary method.