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N- AND P-TYPE LATERAL DMOSFETS INTEGRATION AND OPTIMIZATION IN AN ADVANCE RF BICMOS TECHNOLOGY

机译:在先进的RF BICMOS技术中的N-和P型横向DMOSFET集成和优化

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Integration of RF power amplifier in silicon technology is a new challenge. SiGe:C HBT and RF lateral DMOS are the two main candidates to achieve this objective. A technology, which can propose these two devices at the same time, can be useful in order to combine the advantage of each. In this paper, the integration and optimization of RF N- and P-type lateral DMOSFETs in an advanced 0.25nm RF BiCMOS technology are presented. The main optimization steps on DC and RF parameters are described. Parameter trade off during optimization are highlighted: it is been shown that not only Ron and BVds must be considered; Ioff can also determine optimization. Improvement of dynamic performances by using CoSi{sub}2 instead of TiSi{sub}2 as salicide material is demonstrated on our lateral N-type DMOSFET with a 20% improvement on Fmax.
机译:RF功率放大器在硅技术中的集成是一个新的挑战。 SiGe:C HBT和RF横向DMOS是实现这一目标的两个主要候选者。一种可以同时提出这两个设备的技术可以是有用的,以便组合每个的优点。本文提出了一种先进的0.25nm射频BICMOS技术中RF n型横向DMOSFET的集成和优化。描述了DC和RF参数的主要优化步骤。优化期间的参数折衷突出显示:结果表明,不仅必须考虑RON和BVDS; IOFF还可以确定优化。通过使用Cosi {Sub} 2而不是TISI {sub} 2改善动态性能,因为在我们的横向n型DMOSFET上证明了PALICADE材料,在FMAX上有20%的改善。

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