A Robust MEMS Probe Card for Fine Pitch Test Using A New Cantilever Moving Scheme

摘要

A vertically guided MEMS probe card, designed to achieve a deflection of 50 (mu)m at a force of 1.5 gram (g) and less than 50 (mu)m of pad pitch, was developed. Based on our experimental results, the measured average contact resistance was approximately 0.2 ohm (OMEGA) at 1.44 g of force with leakage current approximately 10 pA between the tips and pads. In addition, tip planarity was about +-6 (mu)m with x-y alignment errors within +-8 (mu)m. A reliability test was performed, the average contact resistance was 0.4 OMEGA and the probe tip wear was less than 1 (mu)m after the 10,000 time touchdowns. This newly proposed probe card is suitable for wafer-level testing and fine pitch device testing.