Integrated Circuit having fine-pitch Pads, and Probe card and method for testing the

摘要

invention is a wafer-level test of the efficiency of the increased cost of the test can be reduced in an integrated circuit chip , the probe card and provides a test method . And spaced from a plurality of output pads and the output pads are arranged in line integrated circuit comprises a plurality of input pads arranged to at least correspond to the two output pads . Includes a plurality of first check tip and a plurality of second test probe tip card for testing the electrical characteristics of the integrated circuit chip is arranged on a printed circuit board and can check more than one chip at the same time .