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A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards

机译:用于表征大阵列微间距微凸点探针卡的全自动测试系统

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A fully automatic test system for characterizing advanced probe cards able to probe on large-array fine-pitch micro-bumps (such as JEDEC's Wide-I/O Mobile DRAM interfaces [1, 2]) has been specified, developed, installed, and brought to a full-operational state. The system is based on a Cascade CM300 probe station from FormFactor and National Instruments PXI test instrumentation and complemented by in-house developed software for automatic test generation and data analysis and visualization. The system is successfully used in conjunction with FormFactor's Pyramid Probe® RBI probe-card technology on WIO1 and WIO2 micro-bump arrays on 0300mm wafers designed and manufactured by IMEC. This paper describes the various system components in hardware and software, and experimental results obtained with several test wafers.
机译:已经指定,开发,安装和描述了一种用于表征高级探针卡的全自动测试系统,该探针卡能够探测大型阵列的细间距微凸点(例如JEDEC的Wide-I / O移动DRAM接口[1、2])。进入了全面运作的状态。该系统基于FormFactor和National Instruments PXI测试仪器的Cascade CM300探针台,并辅以内部开发的软件进行自动测试生成,数据分析和可视化。该系统已成功与FormFactor的Pyramid Probe ® RBI探针卡技术一起用于IMEC设计和制造的0300mm晶圆上的WIO1和WIO2微凸点阵列上。本文描述了硬件和软件中的各种系统组件,以及使用多个测试晶片获得的实验结果。

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