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4H-SiC PLANAR MESFETs WITH F_(max) OF 40 GHz WITHOUT TRAPPING EFFECT

机译:4H-SIC平面MESFET,F_(MAX)为40 GHz而不陷入效果

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The high electric breakdown field, high saturated electron drift velocity, and high thermal conductivity make SiC an attractive material for high power microwave devices. In this work, planar 4H-SiC MESFETs were fabricated using ion-implantation and semi-insulating substrate without recess gate etching to eliminate potential damage in the gate region. Ion-implantation was used to obtain a lower contact resistance. The saturation drain current and transconductance were 440 mA/mm and 26 mS/mm, respectively. The maximum oscillation frequency of 40 GHz and the cut-off frequency of 8.2 GHz were obtained by the RF small-signal measurement. The P_(1dB) of 21.7 dBm and the output power of 1.5 W/mm were also obtained at 2 GHz by the RF large-signal measurement. The fabricated MESFETs showed the charge trapping-free characteristics due to the surface passivation by the thermal oxidation.
机译:高击穿场,高饱和电子漂移速度和高导热率为高功率微波器件制造SIC。在这项工作中,使用离子注入和半绝缘基板制造平面的4H-SiC MESFET,而没有凹陷栅极蚀刻以消除栅极区域中的潜在损坏。使用离子注入来获得较低的接触电阻。饱和漏极电流和跨导分别为440mA / mm和26ms / mm。通过RF小信号测量获得了40 GHz的最大振荡频率和8.2GHz的截止频率。通过RF大信号测量,还在2GHz获得21.7dBm的P_(1DB)和1.5W / mm的输出功率。由于热氧化的表面钝化,所制造的MESFET显示出的电荷捕获的特性。

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