RF Bump Wafer Test Optimized through Clean Pad Selection for Membrane Probe Card

摘要

The wafer-level testing continues to evolve, and advances in probe card development are becoming critical in high volume production fabs. One of the important parametric and probably one of the biggest factors in probe yield loss is contact resistance. This paper discusses the experiment and the methodology for selecting cleaning pad for membrane probe card to improve probe card yield. The criteria for selecting optimum cleaning pad are yield, wear, and particles using on-line cleaning method. Considering overall performance, P6 cleaning pad exhibited optimum condition for cleaning pad selection for this study.