首页> 外文会议>International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference >MICROSCOPY-BASED DESCRIPTION OF CMP PAD MICROTEXTURE AND ASPERITY-SCALE MODELING OF SLURRY FLOW DYNAMICS
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MICROSCOPY-BASED DESCRIPTION OF CMP PAD MICROTEXTURE AND ASPERITY-SCALE MODELING OF SLURRY FLOW DYNAMICS

机译:基于显微镜的CMP垫微纹理和浆料流动动力学粗糙度建模的基于显微镜的描述

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Surfaces of hard polyurethane pads are characterized using confocal reflectance microscopy. Asperities appear as the highest elevations in ridges among pad pores. Imaging of asperities under load shows that pad-wafer contact regions are branched clusters rather than the simple shapes assumed in classical theory. Microscopy images are rendered as 3-D surface maps and computational grids applied for slurry transport calculations. Solution of the momentum equations in the detailed pad texture reveals slurry flow lines that depart significantly from simple streamwise motion. Slurry velocity around individual asperities can exceed the driving pad-wafer relative velocity by over 20percent or may approach zero in deep texture regions. Fluid pressure extremes very near asperities may be of a similar size as the polish pressure and pad elastic reaction force. Pressure drop in the texture is almost one hundred times that of an empty channel of the same maximum height and four times that of an empty channel of the same flow area. Displacement of spent slurry by fresh slurry in the pad texture takes roughly four times longer than predicted based on straight laminar flow. Findings are discussed with regard to optimal asperity shape and defect formation.
机译:使用共聚焦反射显微镜表征硬聚氨酯垫的表面。粗糙度看起来是垫子毛孔之间的脊的最高升高。负载下的粗糙度的成像表明,垫晶片接触区域是分支簇,而不是在经典理论中假设的简单形状。显微镜图像呈现为施加浆料传输计算的3-D表面图和计算网格。详细垫纹理中的动量方程的解决方案揭示了从简单的流动运动显着偏离的浆料流线。各个粗糙度周围的浆料速度可超过驱动焊盘 - 晶片相对速度超过20平方,或者可以在深纹理区域中接近零。极端靠近粗糙度的流体压力可以是与抛光压力和垫弹性反作用力相似的尺寸。纹理中的压降几乎是相同最大高度的空通道的百倍,并且是相同流量区域的空通道的四倍。垫纹理中的新鲜浆料的废浆料的位移大约需要基于直线流动的预测的四倍。关于最佳粗糙形状和缺陷形成讨论了发现。

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