CMP FITTING EQUIPPED WITH APPARATUS FOR SENSING INFLOW OF SLURY BETWEEN PAD AND TURNTABLE AND METHOD FOR SENSING INFLOW OF SLURY BETWEEN PAD AND TURNTABLE

摘要

A CMP fitting equipped with an apparatus for sensing inflow of slurry between a pad and a turntable are provided to prevent adhesion separation between a turntable and a pad by sensing slurry inflow into the edge of the turntable. A wafer(400) is loaded on a wafer carrier(200), and the wafer carrier is contacted with a platen(100) and a wafer lapping process is performed. At the same time, the power source is supplied to an external lead(600b) when the polishing is performed(500), and a slurry is flowed into a contact of turntable and a pad and the external wire and an interior wire is short circuit. The power source supplied to the interior wire is inputted to a central processing unit(700) as an input signal.