CMP Fitting Equipped with Apparatus for Sensing Variation of Pad Backer and Method for Sensing Variation of Pad Backer

摘要

A CMP(Chemical Mechanical Polishing) fitting equipped with apparatus for sensing variation of a pad backer and a method for sensing variation of the pad backer are provided to prevent the efficiency of the CMP process and wafer loss. A pad assembly comprises a pressure rubber equipped in the bottom of a pad backer(40), and a current detector(50) is connected with multipoint of a groove and senses current. A current amplifier(60) amplifies the detected current, and a database(80) stores a current as an initial value at the time when the pad backer is exchanged. A central processing unit(70) determines bending degree of the pad backer by comparing the detected current with the initial value.