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1700 V-IGBT3: field stop technology with optimized trench structure $trend setting for the high power applications in industry and traction

机译:1700 V-IGBT3:现场停止技术,具有优化的沟槽结构$趋势设置,用于工业和牵引力的高功率应用

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The IGBT3 technology, which combines a specific trench cell and the field stop concept, was first introduced for devices with 1200 V blocking voltage. It is now transferred to higher blocking voltage ratings. A new series of 1700 V devices is introduced, which compared with conventional NPT (= non punch through) devices has greatly reduced static and dynamic losses and preserves the well known ruggedness of NPT devices. With this new 1700 V chip generation a new product line of modules with up to 50% higher current capability in the same housing is available.
机译:首先为具有1200V阻挡电压的器件引入特定沟槽和现场停止概念的IGBT3技术。它现在转移到更高的阻塞电压额定值。介绍了一个新的1700 V器件系列,与传统的NPT(=非打孔通过)器件相比大大降低了静态和动态损耗,并保留了NPT器件的众所周知的坚固性。通过这款新的1700 V芯片生成,可以使用高达50%的模块的新产品系列,同一壳体的电流能力高达50%。

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