首页> 外文会议>Computers and Communications, 2005. ISCC 2005. >1700 V-IGBT3: field stop technology with optimized trench structure $trend setting for the high power applications in industry and traction
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1700 V-IGBT3: field stop technology with optimized trench structure $trend setting for the high power applications in industry and traction

机译:1700 V-IGBT3:场截止技术,具有优化的沟槽结构,为工业和牵引领域的高功率应用提供了趋势设定

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摘要

The IGBT3 technology, which combines a specific trench cell and the field stop concept, was first introduced for devices with 1200 V blocking voltage. It is now transferred to higher blocking voltage ratings. A new series of 1700 V devices is introduced, which compared with conventional NPT (= non punch through) devices has greatly reduced static and dynamic losses and preserves the well known ruggedness of NPT devices. With this new 1700 V chip generation a new product line of modules with up to 50% higher current capability in the same housing is available.
机译:IGBT3技术结合了特定的沟槽单元和场停止概念,最初是针对阻断电压为1200 V的器件引入的。现在将其转移到更高的阻断电压额定值。引入了一系列新的1700 V器件,与传统的NPT(=非穿通)器件相比,该器件大大降低了静态和动态损耗,并保留了NPT设备的坚固性。有了这一新一代的1700 V芯片,就可以提供在同一外壳中具有高达50%更高电流能力的模块新产品线。

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