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Mechanism of Charge Injection in Metal/Copper-Phthalocyanine/Metal Structures

机译:金属/铜酞菁/金属结构中电荷注射机理

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It is demonstrated that diode-like current-voltage(J-V) characteristics with very high rectification ratio can be achieved in indium tin oxide(ITO)/Copper-phthalocyanine(Cu-Pc)/metal single layer devices, if an electrode with low work function is used. But, an electrode with high work function, which is comparable to ionization potential of Cu-Pc, results no rectification. It has been shown that the J-V characteristics in the forward direction, when ITO is positively biased, can be explained by bulk limited space charge current modified with field dependent mobility. The J-V characteristics in the reverse direction, when ITO is negatively biased, can be described as tunneling due to Schottky-like barrier at metal/Cu-Pc interface.
机译:结果证明,具有非常高的整流比的二极管样电流(JV)特性可以在氧化铟锡(ITO)/铜 - 酞菁(Cu-PC)/金属单层装置中实现,如果具有低工作的电极使用功能。但是,具有高功函数的电极,与Cu-PC的电离电位相当,结果无整改。已经表明,当ITO积极偏置时,向前方向的J-V特性可以通过散装有限的空间电荷电流来解释,用现场相关的移动性修改。当ITO是负偏置时,沿反向的J-V特性,可以将由于金属/ CU-PC接口的肖特基状屏障而被描述为隧道。

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