Investigation of plane-to-plane noise coupling through cutout in multi-layer power/ground planes

摘要

This paper presents an analytical model of plane-to-plane noise coupling through cutout on multi-layer power/ground planes. The model is expressed in terms of transfer impedance which denotes the coupled voltage when switching current occurs. This model is then compared with measured data up to 10 GHz to verify the validity of the model. The simulation results from the model shows good correlation with measurement. According to the analysis, substantial coupling occurs through cutout at the frequencies of the resonance.