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'RF-SoC': low-power single-chip radio design using Si/SiGe BiCMOS technology

机译:“rf-soc”:低功耗单芯片无线电设计,使用Si / SiGe BICMOS技术

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The integration level of RFICs has exhibited considerable progress during the last decade. Si-based single-chip GSM, Bluetooth and DECT transceivers have been reported, while the most exciting milestone for integration will be the RF-system-on-a-chip (i.e., "RF-SoC") product for single-chip multiband multi-standard cellular ICs that support broadband communication. To achieve this highest level of RFIC integration, one has to choose a radio system architecture that requires a minimal number of external components, together with a judicious selection of the IC technology for implementation. For example, we anticipate the direct-conversion or robust low-IF receiver architecture to become the dominant choice for 3G handset applications. We also expect the Si/SiGe BiCMOS technology to be the optimal device technology for implementing low-power cellular RF-SoC products, while the RF-CMOS technology will probably be most successful for the low-cost, less performance sensitive Bluetooth and/or wireless LAN applications.
机译:RFIC的整合水平在过去十年中表现出相当大的进展。已报告基于SI的单片GSM,蓝牙和DECT收发器,而集成最令人兴奋的里程碑将是用于单芯片多频带的RF系统(即“RF-SoC”)产品支持宽带通信的多标准蜂窝IC。为了实现这一最高水平的RFIC集成,必须选择需要最少数量的外部元件的无线电系统架构,以及可明智地选择IC技术进行实施。例如,我们预计直接转换或强大的低电平架构,可以成为3G手机应用的主导选择。我们还期望SI / SiGe BICMOS技术成为实现低功率蜂窝RF-SoC产品的最佳装置技术,而RF-CMOS技术可能最为成功,对于低成本,性能敏感的蓝牙和/或无线LAN应用程序。

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