Poly Silicon Deposition Process Improvement on 300 mm Wafers (PC23)

摘要

This paper presents the application of advanced process control (APC) to tighten the distribution of LPCVD deposited polysilicon thickness during device manufacturing on 300 mm wafers. Using APC, a 40% reduction in thickness variation is achieved. This improvement is possible by 1) automatically feeding back deposition time adjustments, 2) introduction of load size based compensation and 3) optimizing the response factor in the feed back loop.