Pulse plating of copper for PCBs: effects of eductor agitation with pulsing

摘要

The importance of pulse current plating techniques for copper deposition in printed circuit board (PCB) manufacture is described and three aspects are reviewed: · Solution formulation for pulsing and use of additives · Pulse current and deposit properties · Modelling of deposition in holes, recesses and vias The use of current pulsing with eductor agitation is described and new data presented. The ability to avoid solution and additive oxidation is clear and the opportunity to provide increased mass transfer enhancement over conventional air agitation is emphasised.