The evolution of electrical systems in the last time, the actual generation of electronic integrated circuits that are characterized by very high frequency and very high speed require a very carefully analyze and design of interconnection structures of electronic modules (PCB). Difficulties that could appear in proper working of electronic modules at very high frequency/speed are produced by the discontinuities that appear in the interconnection networks. In this work different types of bend discontinuities are analyzed and simulated. Using method of moment technique, the current/field distribution and S, Y, Z parameters for global characterization were obtained. The RLCG model for compatibility with circuit simulators was extracted, too.
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