EMI/EMC Measurements and Simulations for Cables and PCBs Enclosed Within Metallic Structures

摘要

This paper presents a series of measurements to study various electromagnetic compatibility (EMC)/electromagnetic interference (EMI) coupling scenarios, frequently encountered in electronic systems. Specifically, field penetration through apertures and coupling of penetrating wires onto the printed circuit boards (PCBs) enclosed by resonant structures are considered. In contrast to other measurements, we focus on multi-cavity enclosures in the presence of cables and PCBs. The purpose of this experimental study is to provide accurate reference data for possible future validation of various computational tools and to test their accuracy and efficiency on realistic platforms. In particular, we validate a recently proposed hybrid scheme based on S-parameters for concurrent EMI/EMC analysis of large structures with enclosed linearonlinear circuit devices in active operating mode.