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Low-resistance electrical contacts to p-type GaN by using In{sub}xGa{sub}(1-x)N cap layers

机译:通过使用在{sub} xga {sub}(1-x)n帽层中,低电阻电触点对p型GaN

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A novel type of low-resistance ohmic contacts is demonstrated utilizing polarization-induced electric fields in thin p-type InGaN layers on p-type GaN. An increase of the hole tunneling probability through the barrier and a concomitant significant decrease of the specific contact resistance can be attributed to a reduction of the tunneling barrier width in the InGaN capping layers due to the polarization-induced electric fields. The specific contact resistance of Ni (10 nm)/Au (30 nm) contacts deposited on the InGaN capping layers was determined by the transmission line method. Specific contact resistances of 1.2 × 10{sup}(-2) Ωcm{sup}2 and 6×10{sup}(-3) cm{sup}2 were obtained for capping layer thicknesses of 20 nm and 2 nm, respectively.
机译:利用P型GaN上的薄P型IngaN层中的偏振诱导的电场来证明一种新型的低电阻欧姆触点。通过屏障的孔隧穿概率的增加和特定接触电阻的显着降低可以归因于由于偏振引起的电场引起的INGAN覆盖层中的隧道阻挡宽度的降低。通过传输线法测定沉积在InGaN覆盖层上的Ni(10nm)/ Au(30nm)触点的比接触电阻。获得的1.2×10 {sup}( - 2)ωcm{sup} 2和6×10 {sup}( - 3)cm {sup}( - 3)cm {sup} 2分别用于覆盖20nm和2nm的层厚度。

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