Recent advances in endpoint and in-line monitoring techniques for chemical-mechanical polishing processes

摘要

We present a summary of the recent advances in endpoint and in-line monitoring techniques for chemical-mechanical polishing (CMP) processes. We discuss the technical challenges and review some of the approaches that have been published and/or patented. These methods include optical, thermal (pad temperature), friction (torque motor current), electrochemical, chemical, electrical, and acoustic (vibration). We also present experimental data obtained in our laboratory using selected endpoint methods for metal and oxide CMP.