Solder bars-a novel flip chip application for high power devices

摘要

The compatibility of conventional flip chip technology for high power/high current applications can present functional and reliability issues during the device operating life. Typical flip chip solder bumps can experience early failures due to electromigration when exposed to a high current density at a given junction temperature. As a viable alternative, the solder bar approach was developed to increase the cross-sectional area of the solder joint, there by reducing current density and improving device operating life.