The curing conditions and material properties such as the TCE (thermal coefficient of expansion), T/sub g/ (glass transition temperature), flexural storage modulus, tangent delta, and moisture content of nine different underfill materials from three different vendors are measured. Their flow rate and the effect of moisture content on mechanical (shear) strength in solder bumped flip chips on organic substrate are also determined experimentally. Furthermore, their effects on the electrical performance (voltage) of functional flip chip devices on organic substrate are measured. Finally, a simple methodology is presented for the selection of underfills from the measurement results of these nine different underfill materials.
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机译：测量了来自三个不同供应商的九种不同底部填充材料的固化条件和材料特性，例如TCE（热膨胀系数），T / sub g /（玻璃化转变温度），挠曲储能模量，切线增量和水分含量。还通过实验确定了它们的流速和水分含量对有机衬底上的焊料凸点倒装芯片的机械（剪切）强度的影响。此外，测量它们对有机基板上的功能倒装芯片器件的电性能（电压）的影响。最后，提出了一种简单的方法，用于从这九种不同的底部填充材料的测量结果中选择底部填充材料。
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