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UNDERFILLING MATERIAL FOR FLIP-CHIP FITTED PRINTED CIRCUIT BOARDS, A PRINTED CIRCUIT BOARD EQUIPPED THEREWITH, AND A METHOD FOR FILLING RATIO VERIFICATION OF CHIPS WHICH ARE UNDERFILLED THEREWITH
UNDERFILLING MATERIAL FOR FLIP-CHIP FITTED PRINTED CIRCUIT BOARDS, A PRINTED CIRCUIT BOARD EQUIPPED THEREWITH, AND A METHOD FOR FILLING RATIO VERIFICATION OF CHIPS WHICH ARE UNDERFILLED THEREWITH
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机译:倒装芯片的印刷电路板的填充材料,装有印刷电路板的填充材料以及填充芯片的比例验证的方法
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摘要
The invention relates to a method for verifying the distribution and the filling ratio of underfilling materials by means of X-ray inspection, for example, to detect how they are mounted between the chip and the substrate during or after the soldering of chips on a substrate. Said substrate is provided for mechanical support and for supporting the solder bumps. According to the invention, an auxiliary substance or filling substance which absorbs X-rays is incorporated in the underfilling material. The invention makes it possible to reliably test such underfilling stabilizations also during a running production process for fitted printed circuit boards.
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