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Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip

机译:垂直过渡,具有其的印刷电路板以及具有印刷电路板和半导体芯片的半导体封装

摘要

Provided are vertical transitions which have the high electrical performance and the high shielding properties in the wide frequency band in a multilayer PCB, printed circuit boards with the vertical transitions and semiconductor packages with the printed circuit boards and semiconductor chips. In vertical transitions for a multilayer PCB, a wave guiding channel is a conductor which includes at least more than one of signal vias 201, an assembly of ground vias 202 surrounding the signal via, ground plates from conductor layers of the PCB connected to the ground vias, closed ground striplines 205 connecting the ground vias and power supply layer.
机译:提供了多层PCB中在宽频带中具有高电性能和高屏蔽性能的垂直过渡,具有垂直过渡的印刷电路板以及具有印刷电路板和半导体芯片的半导体封装。在多层PCB的垂直过渡中,波导通道是一种导体,其包括至少一个以上的信号过孔 201 ,围绕信号的接地过孔 202 的组合通孔,来自PCB导体层的接地板连接到接地通孔,闭合的接地带状线 205 连接接地通孔和电源层。

著录项

  • 公开/公告号US8035992B2

    专利类型

  • 公开/公告日2011-10-11

    原文格式PDF

  • 申请/专利权人 TARAS KUSHTA;KAORU NARITA;

    申请/专利号US20060089483

  • 发明设计人 TARAS KUSHTA;KAORU NARITA;

    申请日2006-10-10

  • 分类号H05K9;

  • 国家 US

  • 入库时间 2022-08-21 18:13:54

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