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机译:金钉凸点与Sn-0.7Cu焊料用于倒装芯片功率器件封装的混合互连的微结构和可靠性
Shenzhen Univ Town, Harbin Inst Technol, Shenzhen Grad Sch, State Key Lab Adv Welding & Joining, HIT Campus, Shenzhen 518055, Peoples R China;
Shenzhen Univ Town, Harbin Inst Technol, Shenzhen Grad Sch, State Key Lab Adv Welding & Joining, HIT Campus, Shenzhen 518055, Peoples R China;
Shenzhen Univ Town, Harbin Inst Technol, Shenzhen Grad Sch, State Key Lab Adv Welding & Joining, HIT Campus, Shenzhen 518055, Peoples R China;
Au stud; Au-Sn compounds; Interconnections; Electromigration; Reliability; Power electronics;
机译:模版印刷法Sn-0.7Cu倒装焊锡凸块的组织和力学性能
机译:金螺柱凸点拓扑对柔性互连倒装芯片可靠性的影响
机译:AG和AG-4PD螺栓凸起与SN-3AG-0.5CU焊料的互晶反应,用于倒装芯片包装
机译:成型互连器件上的凸块凸焊键合倒装芯片技术的可靠性研究
机译:低成本衬底上凸焊倒装芯片的可靠性研究和技术开发。
机译:使用超声波传感器检查倒装芯片焊锡凸点的缺陷
机译:通过PB的焊料和Au凸块加入的倒装芯片互连系统的热可靠性的提高