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DISLOCATIONS GENERATION IN SELECTIVE AND NON-SELECTIVE SiGe EPITAXY

机译:选择性和非选择性SiGe外延的脱位生成

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In this paper, we investigate the influence of the isolation structure (Shallow Trench Isolation versus LOCal Oxidation Structure) on dislocation nucleation for a non-selective epitaxial growth. In our experimental conditions, no major difference is found. On the other hand, the reduction of misfit dislocation density with a selective epitaxial growth versus non-selective epitaxial growth is studied experimentally. The experiments were performed on Si_(1-x)Ge_x layers with x = 0.13 grown on LOCOS substrates. The misfit dislocations were detected by optical microscopy, TEM, AFM, and X-ray diffraction. Our results demonstrate the huge superiority of SEG in terms of critical thickness. This difference between SEG and NSEG allow us to clearly identify the major cause of stress relaxation, which is the polycrystalline silicon at the edges of the monocrystalline areas in the case of non-selective epitaxy.
机译:在本文中,我们研究了隔离结构(浅沟间隔离与局部氧化结构)对非选择性外延生长的脱位成核的影响。在我们的实验条件下,没有发现主要差异。另一方面,通过实验研究了选择性外延生长与非选择性外延生长的错配脱位密度的降低。在Si_(1-x)Ge_x层上进行实验,在LocOS基材上生长X = 0.13。通过光学显微镜,TEM,AFM和X射线衍射检测错配脱位。我们的结果表明了在临界厚度方面的巨大优越性。 SEG和NSEG之间的这种差异使我们能够清楚地识别应力松弛的主要原因,这是在非选择性外延的单晶区域的边缘处的多晶硅。

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