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Defect density in non-selective and selective Si/SiGe structures

机译:非选择性和选择性Si / SiGe结构中的缺陷密度

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摘要

The epitaxial quality of Si (non-selective or selective epitaxy)/SiGe (non-selective or selective epitaxy) structures applying Si_2H_2Cl_2 or SiH_4 as the Si source has been studied. High-resolution reciprocal lattice mapping and X-ray reflectivity measurements have been used to characterise the epitaxial quality and the interfacial defects, respectively. The surface morphology of the structures was studied by atomic force microscopy. It is shown that the generation of defects in non-selective SiGe layers is strongly dependent on the thickness of the buffer layer. Moreover, the selective growth of a Si buffer layer requires a growth temperature above 770 deg C in order to obtain a smooth layer surface, which is beneficial for the succeeding growth of the SiGe layer.
机译:研究了以Si_2H_2Cl_2或SiH_4为硅源的Si(非选择性或选择性外延)/ SiGe(非选择性或选择性外延)结构的外延质量。高分辨率倒易晶格映射和X射线反射率测量已分别用于表征外延质量和界面缺陷。通过原子力显微镜研究了结构的表面形态。已经表明,在非选择性SiGe层中缺陷的产生强烈地依赖于缓冲层的厚度。而且,Si缓冲层的选择性生长需要高于770℃的生长温度以获得光滑的层表面,这对于SiGe层的后续生长是有利的。

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